scia Magna 200

sciaMagna200-1

scia Magna 200 Deposition System

The scia Magna 200 uses a unique Double Ring Magnetron architecture to achieve very high homogeneity of coatings at impressively high deposition rates. Typical applications include piezoelectric layers, optical coatings and passivation layers.

The system is available with either a single wafer load lock or an automatic handling robot in a cluster configuration. Its advanced substrate holder features simultaneous rotation, helium cooling and RF bias. The special DRM 400 sputter source from Fraunhofer FEP has individually controllable plasma discharges from the concentric inner and outer target rings, enabling layer thickness homogeneities of up to ± 0.5 % (over 200 mm). At the same time, very high deposition rates in reactive sputter mode can be achieved. Due to its integrated control mechanisms, long term stability of processing is ensured.

Features

  • Double Ring Magnetron (DRM 400) sputter source with
  • DC, uni- and bipolar pulse modes
  • High deposition rate (5 nm/s for SiO2 and 3 nm/s
  • for Al2O3)
  • Film thickness homogeneity of ± 0.5 %
  • over 200 mm wafers
  • Precise regulation of reactive processes for high
  • deposition rates and long term stability
  • Automatic magnet adjustment to compensate for
  • sputter target erosion
  • Sample stage with RF bias, 20 rpm rotation and helium
  • backside cooling contract
  • Cluster layout available

Applications

  • Temperature compensation layers forSAW devices (SiO2)
  • Piezoelectric fi lms with excellent crystalline orientation (AlN)
  • Optical coatings (Si3N4, SiO2, HfO2, Ta2O5, Al2O3)
  • Electrical insulating fi lms (Si3N4, SiO2, Al2O3)

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