Applications addressed by AARD Technology are found in the MEMS, TFH, and Optics industries.

Wafer mit Mikromechanik

MEMS manufacturing requires precise control layer thicknesses and geometries of features.

Localized trimming of film thickness variations across a wafer using a focused broad ion beam (Ion Beam Trimming or IBT) may be used by manufacturers of RF-MEMS for yield enhancement.

Etching and milling of device features by ion beam milling is also used.


Computer hard disk drive inside

Thin Film Head manufacturers may also acheive yield enhancement by using localized ion beam trimming (IBT) to trim variations in geometries as they vary across a wafer.

Selectivity of etch between insulators and metals may also be employed to reduce step heights between materials after CMP.


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